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Foundry Solutions Overview
• Advanced Logic
• 28nm MPW & Offering
• 28nm IP & Service
• 40nm
• 65nm/55nm
• Mature Logic
• 90nm, 0.13/0.11µm, 0.15µm,   0.18µm, 0.25µm, 0.35µm
• eNVM
• Mixed Signal & RF
• Analog & Power
• Display Driver IC (DDIC)
• CMOS Image Sensor (CIS)
• Non-Volatile Memory (NVM)
• IoT Solutions
• Automotive
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IoT Solutions
SMIC Offers a Complete One-Stop IoT Technology Platform to Build a Smart and Secure IoT World

Through continuous enhancements in the mature technology platform, SMIC now offers a complete one-stop service for IoT (Internet of Things) technology, manufacturing and chip design. Together with partners in the IC ecosystem, SMIC helps design houses to make IoT smart hardware chips which can be used in smart home, smart energy, safety & security, industrial & robots, wearable devices, automotive, transportation, logistic, environment, agriculture, health monitoring and medical, and other applications. As the largest and most advanced semiconductor foundry in Mainland China, SMIC will provide professional, secure and complete local services as well as help design houses shorten time-to-market, reduce costs and establish a strong position in the emerging IoT market.

  • Both 8’’ and 12’’ Technology Platform Ready - 55nm low leakage eFlash in mass production
    IoT products usually have a wide range of functions and a quick response to the market. The product mix covers sensors, microprocessors, memory and connectivity and focuses on small volume and low power consumption. SMIC’s range of low power logic and RF process technologies from 0.18μm down to 28nm enables IC design houses to produce ICs for IoT applications in smart home, wearable devices, smart city, and related applications. SMIC’s 0.13µm and 55nm low power embedded Flash (eFlash) technologies can further integrate internal memories solutions, with proven, stable mass production. The smart card chip which adopted SMIC’s 55nm low leakage eFlash technology has passed strict product reliability tests and has been launched into the market successfully.
  • Excellent SPOCULLTM 95ULP and 55nm ULP (Ultra Low Power) technology platforms
    SMIC also provides SPOCULLTM 95ULP (Ultra Low Power) Technology platform. SPOCULL stands for SMIC POly Contact for Ultra Low Leakage. SPOCULLTM 95ULP provides the highest density solution and smallest SRAM at 8” foundry technology. It has excellent transistor characteristics with low leakage, low power and low parasitic capacitance. SMIC also provides a 55nm ULP technologies platform. By reducing products’ operating voltage, and optimization of device and IP design, SMIC’s ULP solutions can greatly reduce both dynamic and static power consumption of products, and optimize cost structure and performance by integrating RF and embedded memory technologies.
  • SMIC offers MEMS Sensors technology platforms
    This is an one-stop solution for SoC, SiP, WLP and 2.5D packaging through integration of RF, baseband, MCU, eFlash, and MEMS sensor to help customers shorten the production cycle,optimize the product cost and form factor.
  • Comprehensive IoT IP/Subsystem ecosystem
    By establishing good partnerships with global and domestic IP partners, SMIC can offer a complete, high quality IP and design service in RF, baseband, eFlash, CPU and DSP IP core, foundation library IP, power management IP, information security IP, and analog interface IP. And for new applications, SMIC can provide specific types of subsystems such as voice/image processing, low power wide area connectivity and so on.

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